Gary E. Dickerson
President and Chief Executive Officer at Applied Materials
Thank you, Mike. Applied Materials delivered a strong finish to our fiscal year with record quarterly performance. Throughout 2022, the company has demonstrated solid execution, while navigating COVID-related restrictions, supply-chain shortages and a challenging geopolitical and macroeconomic environment.
I would like to recognize the hard work and commitment of our global team and our suppliers, who are doing everything possible to meet our customers' needs. As this is our year-end call, I'll begin my prepared remarks with a quick review of our performance and progress over the past 12 months; I'll then give our latest outlook for 2023 before describing our longer-term growth thesis for the industry and Applied; after that Brice will provide more color on our financial performance and key areas of operational focus.
Like many others in the technology sector, our performance and priorities in 2022 have been shaped by an unprecedented set of challenges. Our top priority has been mitigating supply chain constraints that prevented us from fully meeting customer demand. In Q4, we made incremental progress and we expect to continue closing supply gaps over the next few quarters. As well as finding creative short-term solutions, our team has been addressing root causes and building a more resilient scalable supply-chain and stronger strategic relationships with our suppliers. In addition, we are strengthening our own manufacturing, logistics and supply chain management.
While I'm pleased with the recent improvements in supply chain performance, we are still supply chain limited across a number of key product lines and our backlog grew in Q4. The biggest supply constraints are in our metal deposition business where customer demand is very strong. This is our largest business unit and where we have highly differentiated solutions for advanced foundry-logic and DRAM. The market for these products, which enable next-generation wiring is expanding considerably.
In addition to supply shortages, we're also navigating a difficult geopolitical environment as reflected in the new export control regulations enacted by the US government on October 7th. These new rules are complex and cover a broad range of semiconductor technology that includes wafer fabrication equipment and related parts and services. We have taken all the necessary actions to comply with these new rules including suspending shipments and support where required.
We estimate that the unmitigated impact to our fiscal 2023 revenues could be up to $2.5 billion. We believe the actual impact can be reduced to $1.5 billion to $2 billion. This will depend in-part on how quickly the government provides licenses and approvals as well as how impacted companies refocus their investments. We are also mindful of the macroeconomic headwinds, including inflation and softening consumer demand. To offset the inflationary cost increases we are facing, we are driving multiple initiatives that include reengineering our products and implementing price adjustments.
While it's too early to forecast 2023 with any precision, I can describe what we're currently seeing in the market and hearing from our customers. Starting with memory, spending is expected to be down year-on year as weakness in consumer electronics and PCs prompts some customers to defer capacity additions. In leading-edge foundry-logic, demand looks strong, with customers racing for leadership and driving major technology inflections that determine their relative competitive positions.
In ICAPS, chips for the IoT, communications, auto, power and sensor markets demand is mixed. Consumer-driven markets are clearly softer, while the automotive, industrial and power markets remain robust. Those investments are underpinned by large inflections, including the transition to electric vehicles, accelerated adoption of industrial automation and growing demand for renewable energy solutions especially in Europe. While all of this adds up to an expected pullback in overall wafer fab equipment spending next year, we believe that Applied's business will be more resilient than the underlying market for three key reasons.
First, we have a significant backlog the highest in our history measured on both an absolute and percentage of revenue basis. Second, demand for some of our most differentiated product lines while we have uniquely enabling technology remains much higher than our capacity to fulfill that demand. And third, our service business is positioned for steady growth with an increasingly large portion of this business being converted to subscriptions. Over the past 12 months, our installed-base of systems grew 8% and the number of tools under a comprehensive long-term service contracts grew 16%. The renewal rate for these agreements as well over 90%, which demonstrates the value customers see in our subscription services.
Looking further ahead, our long-term growth thesis for the industry and Applied Materials has not changed. Semiconductors are the foundation of digital transformation that will touch almost every sector of the economy over the coming years. This puts the semiconductor industry on a path to $1 trillion market by the end-of-the decade and while every year will not be an up year the overall trajectory is clear. We also like where Applied Materials plays within the ecosystem. As technology complexity is increasing we expect equipment intensity to remain at today's levels or rise further. This means wafer fab equipment is likely to grow faster than the overall semiconductor market.
Within equipment spending, major technology inflections are enabled by materials engineering shifting more dollars to Applied's available markets over time. We think about the industry's future roadmap in terms of power, performance, area-cost, and time-to-market. The PPACt playbook has five pillars; new architectures, new 3D structures, new materials, new ways to shrink and advanced packaging, with each pillar made-up of multiple technology inflections. For example, new 3D structures like Gate All Around transistors and Backside Power Distribution networks, our materials engineering enabled inflections that grow Applied's total available market.
As I referenced earlier, wiring is a key bottleneck for chip performance and power at advanced nodes. And this is driving significant innovation in new materials. Between the seven and three nanometer node, contact metallization steps are growing more than 50% and our total available market is expanding almost 80%. For interconnect layers, process steps are being added even faster and we expect our revenue opportunity to approximately triple through these node transitions.
Advanced packaging represents a new era for integrated circuit design that opens major new vectors of innovation for chip designers. Advanced packaging is also enabled by new materials engineering solutions. Although the industry is still in the early stages of adoption, we have already grown our packaging equipment business to nearly $1 billion. Our Process Diagnostics and Controls business also has broad exposure to these inflections and delivered significant growth in 2022. Our progress and opportunities in eBeam will be the focus of our December technology briefing.
Given our positive long-term view of the semiconductor market, the outsized opportunities for Applied Materials within the market and favorable global government incentives we are making investments in R&D and infrastructure to support the industry growth and position the company for future success. We will provide more details about our specific plans in the coming months. At the same time, with the current macroeconomic conditions, we are carefully managing discretionary spending and limiting hiring to only strategic positions.
Before I hand the call over to Brice, I'll quickly summarize. Applied Materials ended the year strong with record performance. In the past quarter, we made incremental progress overcoming the supply challenges that have constrained our performance in fiscal 2022, however, there is still work to do and our backlog continues to grow. We expect 2023 to be a down year for wafer fab equipment spending, but we believe that Applied's business will be more resilient.
Thanks to our large backlog growing service business and strong customer demand for our leadership products that enable key technology inflections. Longer-term secular trends create opportunities for Applied to outgrow the semiconductor market by enabling the PPACt road-map with our differentiated portfolio of materials engineering solutions. We are making strategic investments for the future whilst slowing spending growth in the near-term.
Now, I'll hand over to Brice.