Lotus Technology Co., Ltd., headquartered in China, develops, manufactures and sells advanced semiconductor assembly and testing equipment. Its product portfolio includes flip chip bonders, ultrasonic wire bonders, package inspection systems, die sorters and integrated automation solutions designed for wafer-level packaging, 3D heterogeneous integration and other advanced packaging processes.
The company’s systems are used by chip foundries, outsourced semiconductor assembly and test (OSAT) providers and integrated device manufacturers across a range of applications, including logic, memory, power and RF devices. Lotus Technology’s equipment aims to improve manufacturing yield, throughput and cost efficiency for both high-volume production and research-and-development environments.
Founded in 2016, Lotus Technology has built a global footprint through direct sales offices, regional service centers and partnerships with local distributors. The company serves customers in Asia, Europe and North America, enabling it to address diverse manufacturing standards and support the world’s leading semiconductor hubs.
In June 2023, Lotus Technology completed its initial public offering on the Nasdaq under the ticker symbol LOTWW. The company is led by a management team with extensive experience in semiconductor equipment design, process integration and customer support, positioning it to capitalize on growing demand for advanced packaging solutions.
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