ASE Technology Holding Co., Ltd. (NYSE: ASX) is a leading provider of semiconductor assembly and testing services. The company offers a comprehensive suite of backend manufacturing solutions, including IC packaging, wafer probing, final testing and advanced system-in-package (SiP) technologies. ASE’s services support a broad range of integrated circuits used in consumer electronics, automotive systems, communications infrastructure and computing applications.
Founded in 1984 and headquartered in Kaohsiung, Taiwan, ASE has grown into one of the world’s largest independent semiconductor assembly and test suppliers. The company operates a global network of manufacturing and R&D facilities across Taiwan, China, Southeast Asia, Japan, Korea, Europe and the United States. This international footprint allows ASE to provide responsive engineering support and tailored solutions to major foundries, fabless semiconductor companies and original equipment manufacturers.
ASE’s product offerings encompass advanced packaging formats such as flip-chip, multi-chip modules, 3D IC stacking and wafer-level packaging. These technologies are designed to enhance device performance, reduce power consumption and shrink form factors for next-generation electronics. The company continually adapts its processes to meet evolving requirements in high-speed connectivity, electric vehicle powertrains, artificial intelligence and 5G communications.
Research and development is a key focus for ASE, with partnerships spanning academic institutions and industry consortia to drive innovation in packaging materials, thermal management and automated testing. Backed by a senior leadership team with decades of semiconductor expertise, ASE Technology remains committed to expanding its capabilities and supporting customers as they develop the chips that power modern digital life.
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