Disco Corporation (OTCMKTS: DSCSY) is a Japan-based manufacturer specializing in high-precision wafer processing equipment for the semiconductor and electronics industries. Founded in 1937 and headquartered in Tokyo, the company has built a reputation for developing advanced dicing saws, wafer back-grinding systems, laser processing machines and cleaning equipment that enable the slicing, thinning and preparation of semiconductor wafers with submicron accuracy.
Disco’s core product portfolio includes diamond-blade dicing saws used to separate individual semiconductor dies, wafer thickness grinders designed to reduce wafer thickness after dicing, and laser processing tools for precise ablation and hole drilling. These systems are integral to the production of memory chips, logic devices, LED packages and automotive sensors, where tight tolerances and high throughput are essential for yield and reliability.
With a global presence, Disco serves semiconductor manufacturers, OSAT (outsourced semiconductor assembly and test) providers and research laboratories across Asia, North America and Europe. In addition to its Tokyo headquarters, the company operates sales, service and manufacturing facilities in Taiwan, China, South Korea, Singapore and the United States, offering on-site installation, technical support and preventative maintenance to ensure continuous equipment performance.
Committed to ongoing R&D, Disco collaborates with semiconductor fabs and research institutions to develop next-generation wafer processing solutions that address the demands of advanced node geometries and heterogeneous integration. By focusing on process automation, precision engineering and yield improvement, the company continues to play a vital role in enabling the production of smaller, faster and more energy-efficient electronic devices worldwide.
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