Disco Corporation (OTCMKTS:DSCSY), headquartered in Tokyo, Japan, specializes in the design, development and manufacture of high‐precision cutting, grinding and polishing equipment for the global semiconductor and electronics industries. The company’s core technologies center on wafer dicing, slicing and back‐grinding, delivering solutions that enable the production of smaller, more complex semiconductor devices, micro‐electromechanical systems (MEMS) components and advanced optoelectronic products.
Disco’s product portfolio includes automatic dicing saws, wafer‐slicing machines, thin‐grinding systems and diamond‐wheel dressing equipment. These tools are complemented by a range of consumables and process support services, such as electroformed blades and custom grinding solutions tailored to clients’ specifications. By offering both hardware and engineering expertise, Disco helps semiconductor manufacturers optimize throughput, maintain tight tolerance requirements and accelerate time‐to‐market for next‐generation chips.
Founded in the late 1930s, Disco has built a reputation for pioneering diamond‐based cutting technology and expanding its footprint across Asia, North America and Europe. The company operates R&D centers and production facilities in Japan, the United States, Germany, Taiwan, South Korea and China, supported by a global network of sales and service offices. This international presence enables Disco to serve leading foundries, assembly houses and electronics suppliers worldwide.
Led by an experienced board of directors and executive management team, Disco is committed to continuous innovation, investing in research collaborations with universities and industry consortia. The company’s strategic focus on miniaturization, high‐precision processing and sustainable manufacturing practices positions it to address evolving requirements in semiconductor packaging, 5G communications, power electronics and emerging device platforms.
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