Oxford Instruments (LON:OXIG) Sets New 1-Year Low - Time to Sell?

Oxford Instruments plc (LON:OXIG - Get Free Report) hit a new 52-week low during mid-day trading on Thursday . The stock traded as low as GBX 1,870 ($23.66) and last traded at GBX 1,870 ($23.66), with a volume of 5911 shares trading hands. The stock had previously closed at GBX 1,950 ($24.67).

Analysts Set New Price Targets

Several equities analysts recently issued reports on the company. Berenberg Bank reduced their price objective on Oxford Instruments from GBX 2,925 ($37.01) to GBX 2,830 ($35.81) and set a "buy" rating on the stock in a research note on Tuesday, November 12th. Shore Capital reaffirmed a "buy" rating on shares of Oxford Instruments in a report on Wednesday, October 16th.

Oxford Instruments Price Performance

The company has a market capitalization of £1.16 billion, a P/E ratio of 2,304.65, a PEG ratio of -3.56 and a beta of 0.96. The company has a quick ratio of 1.11, a current ratio of 1.64 and a debt-to-equity ratio of 12.96. The business has a 50 day simple moving average of GBX 2,089.23 and a 200-day simple moving average of GBX 2,302.52.

Oxford Instruments Cuts Dividend

The company also recently declared a dividend, which will be paid on Friday, January 10th. Shareholders of record on Thursday, November 28th will be paid a GBX 5.10 ($0.06) dividend. The ex-dividend date is Thursday, November 28th. This represents a dividend yield of 0.24%. Oxford Instruments's payout ratio is currently 2,441.86%.

Oxford Instruments Company Profile

Oxford Instruments plc provide scientific technology products and services for academic and commercial organizations worldwide. It operates through three segments: Materials & Characterisation, Research & Discovery, and Service & Healthcare. The company offers atomic force, electron, and Raman microscopy; deposition tools comprising plasma enhanced chemical vapour deposition, chemical vapour deposition, inductively coupled plasma chemical vapour deposition, atomic layer deposition, and ion beam deposition systems; and etch tools, including inductively coupled plasma etching, reactive ion etching, deep silicon etching, atomic layer etching, and ion beam etching systems.